Curiculum Vitae

• Christian Scheibe Project Management (2009)
  Interim support of research and technology transfer projects for the semiconductor industry e.g.
  -process optimization of 32/28nm high-k metal-gate foundry technology
   at GLOBALFOUNDRIES Dresden Module Two LLC/ Germany
  -interim project management for the CMOS-Logic technology and  product
   transfer to Grace Semiconductor Manufacturing Corp.; Shanghai/ China


• Program management of 90 & 75nm DRAM technology development and lead products (512M,1G) in cooperation with Nanya Technologies, Taiwan
  Infineon Technologies AG, Dresden/ Germany (2002-06)
  
• Project management and development of nonvolatile memory (32M FeRAM) in cooperation with Toshiba Semiconductor Corp.
  Infineon Technologies Japan K.K., Yokohama/ Japan (2000-02)
• Productengineer 0.25um DRAM: knowhow transfer, product introduction and rampup 256M DRAM at 200mm fab Dresden
  Siemens Microelectronics Center OHG, Dresden/ Germany (1997-99)
• Device Design and product characterization at 0.25um DRAM development cooperation with IBM and Toshiba Semiconductor Corp.
  Siemens Components Inc., New York/ USA (1995-96)
• PhD "Dr.-Ing" in Electrical Engineering, "Design and Development of a micro structured capacitive Chemical Sensor with on-chip Heater up to 450C"
  Technical University Berlin, EE, Institute for Mikroperipherik (1996)
• Development of micro structured catalytic chemical sensors for Dornier, Friedrichshafen/ Germany
  Technical University Berlin, EE, Institute for Mikroperipherik (1991-94) 
• Graduation "Dipl.-Ing" in Electrical Engineering (Semiconductor Physics / Microelectronics); Diploma thesis at Heinrich-Hertz-Institute Berlin "Development and Characterisation of MBE grown SQW-HFETs"
  Technical University Berlin, Electrical Engineering (1985-91)
• Abitur at Erich-Hoepner-Oberschule, Berlin (1978-84)
• Elementary School, Berlin (1972-78)
• Born July the 29th of 1965 at Berlin

Please find an overview on my publications here.

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